Intel announces the first 14 nanometre processor

At the Computex conference in Taipei, chipmaker Intel has revealed a fanless mobile PC reference design using the first of its next-generation 14nm "Broadwell" processors.

14 nanometre processor mobile tablet device

The 2 in 1 pictured here is a 12.5" screen that is just 7.2 mm thick with keyboard detached and weighs 670 grams. The Surface Pro 3 – for comparison – is 9.1 mm thick and weighs 800 grams. It includes a media dock that provides additional cooling for a burst of performance. The next-generation chip is purpose-built for 2 in 1s and will hit the market later in 2014. Called the Intel Core M, it will be the most energy-efficient Intel Core processor in the company's history with power usage cut by up to 45 percent, resulting in 60 percent less heat. The majority of designs based on this new chip are expected to be fanless, with up to 32 hours of battery life, offering both a lightning-fast tablet and razor-thin laptop.

Intel is also delivering innovation and performance for the most demanding PC users. During the conference, the company introduced its 4th generation Core i7 and i5 processor "K" SKU – the first from Intel to deliver four cores at up to 4 GHz base frequency. This desktop processor, built for enthusiasts, enables new levels of overclocking capability. Production shipments begin this month.

Intel also outlined progress towards a vision to deliver 3-D camera and voice recognition technologies to advance more natural, intuitive interaction with computing devices. The latest RealSense software development kit will be made available in the third quarter of 2014, providing opportunity for developers of all skill levels to create user interfaces.

Computer processors continue to get smaller, faster and cheaper thanks to Moore's Law – expanding the scale and potential for technology in everything from cloud computing and the Internet of Things, to mobile phones and wearable technology.

"The lines between technology categories are blurring as the era of integrated computing takes hold where form factor matters less than the experience delivered when all devices are connected to each other and to the cloud," said Renée James, Intel Corporation President. "Whether it's a smartphone, smart shirt, ultra-thin 2-in-1, or a new cloud service delivered to smart buildings outfitted with connected systems, together Intel and the Taiwan ecosystem have the opportunity to accelerate and deliver the value of a smart, seamlessly connected and integrated world of computing."

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